Your Top 50 most-cited badge
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The article
Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review
Yingfeng Wen, Chao Chen, Yunsheng Ye, Zhigang Xue, Hongyuan Liu, Xingping Zhou and 4 more
- Rank
- 50 of 2,226
- Percentile
- top 2.3%
- Where
- Advanced Materials, 2022
- Citations
- 371
From the 2022 list, OpenAlex counts as of 2026-10-29.
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