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The article
Bismaleimide/Phenolic/Epoxy Ternary Resin System for Molding Compounds in High-Temperature Electronic Packaging Applications
Xiaohan Li, Yanglong Zhou, Ying Bao, Wei Wei, Xiaoma Fei, Xiaojie Li and 1 more
- Rank
- 50 of 1,619
- Percentile
- top 3.1%
- Where
- Industrial & Engineering Chemistry Research, 2022
- Citations
- 63
From the 2022 list, OpenAlex counts as of 2026-10-29.
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