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The article

Room-temperature wafer bonding of LiNbO 3 and SiO 2 using a modified surface activated bonding method

Ryo Takigawa, Eiji Higurashi, Tanemasa Asano

Rank
50 of 1,406
Percentile
top 3.6%
Where
Japanese Journal of Applied Physics, 2018
Citations
39

From the 2018 list, OpenAlex counts as of 2026-10-29.

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