Your Top 50 most-cited badge
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The article
300 mm wafer-level hybrid bonding for Cu/interlayer dielectric bonding in vacuum
Masahisa Fujino, Kenji Takahashi, Yuuki Araga, Katsuya Kikuchi
- Rank
- 43 of 1,558
- Percentile
- top 2.8%
- Where
- Japanese Journal of Applied Physics, 2019
- Citations
- 39
From the 2019 list, OpenAlex counts as of 2026-10-29.
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