Your Top 50 most-cited badge
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The article
Instant Cu-to-Cu direct bonding enabled by 〈111〉-oriented nanotwinned Cu bumps
Kai Cheng Shie, Jing-Ye Juang, Chih Chen
- Rank
- 41 of 1,558
- Percentile
- top 2.7%
- Where
- Japanese Journal of Applied Physics, 2019
- Citations
- 40
From the 2019 list, OpenAlex counts as of 2026-10-29.
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