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The article
Electrical evaluation of copper damascene interconnects based on nanoimprint lithography compared with ArF immersion lithography for back-end-of-line process
Kenta Suzuki, Sung-Won Youn, Tetsuya Ueda, Hiroshi Hiroshima, Yasuhiko Hayashi, Masaki Ishida and 4 more
- Rank
- 49 of 758
- Percentile
- top 6.5%
- Where
- Japanese Journal of Applied Physics, 2024
- Citations
- 9
From the 2024 list, OpenAlex counts as of 2026-10-29.
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