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The article

Opportunities and challenges of 2D materials in back-end-of-line interconnect scaling

Chun‐Li Lo, Benjamin A. Helfrecht, Yanbo He, David M. Guzman, Nicolas Onofrio, Shengjiao Zhang and 3 more

Rank
59 of 2,129
Percentile
top 2.8%
Where
Journal of Applied Physics, 2020
Citations
84

From the 2020 list, OpenAlex counts as of 2026-10-29.

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